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PD - 9.1105
IRGBC20KD2
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
Features
* Short circuit rated -10s @125C, V GE = 15V * Switching-loss rating includes all "tail" losses TM * HEXFRED soft ultrafast diodes * Optimized for high operating frequency (over 5kHz) See Fig. 1 for Current vs. Frequency curve
C
Short Circuit Rated UltraFast CoPack IGBT
VCES = 600V VCE(sat) 3.5V
G
@VGE = 15V, IC = 6.0A
E
n-channel
Description
Co-packaged IGBTs are a natural extension of International Rectifier's well known IGBT line. They provide the convenience of an IGBT and an ultrafast recovery diode in one package, resulting in substantial benefits to a host of high-voltage, high-current, applications. These new short circuit rated devices are especially suited for motor control and other applications requiring short circuit withstand capability.
Absolute Maximum Ratings
Parameter
VCES IC @ T C = 25C IC @ T C = 100C ICM ILM IF @ T C = 100C IFM tsc VGE PD @ T C = 25C PD @ T C = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw.
TO-220AB
Max.
600 10 6.0 20 20 7.0 20 10 20 60 24 -55 to +150 300 (0.063 in. (1.6mm) from case) 10 lbf*in (1.1 N*m)
Units
V
A
s V W
C
Thermal Resistance
Parameter
RJC RJC RCS RJA Wt Junction-to-Case - IGBT Junction-to-Case - Diode Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Weight
Min.
-- -- -- -- --
Typ.
-- -- 0.50 -- 2 (0.07)
Max.
2.1 3.5 -- 80 --
Units
C/W
g (oz)
Revision 2
C-897
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IRGBC20KD2
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
VCE(on)
Parameter Collector-to-Emitter Breakdown Voltage Temp. Coeff. of Breakdown Voltage Collector-to-Emitter Saturation Voltage
VGE(th) VGE(th)/TJ gfe ICES VFM IGES
Gate Threshold Voltage Temperature Coeff. of Threshold Voltage Forward Transconductance Zero Gate Voltage Collector Current Diode Forward Voltage Drop Gate-to-Emitter Leakage Current
Min. Typ. Max. Units Conditions 600 -- -- V VGE = 0V, I C = 250A -- 0.37 -- V/C VGE = 0V, IC = 1.0mA -- 2.4 3.5 IC = 6.0A V GE = 15V -- 3.6 -- V IC = 10A See Fig. 2, 5 -- 2.8 -- IC = 6.0A, T J = 150C 3.0 -- 5.5 VCE = VGE, IC = 250A -- -11 -- mV/C VCE = VGE, IC = 250A 1.9 3.3 -- S VCE = 100V, I C = 6.0A -- -- 250 A VGE = 0V, V CE = 600V -- -- 1700 VGE = 0V, V CE = 600V, T J = 150C -- 1.4 1.7 V IC = 8.0A See Fig. 13 -- 1.4 1.7 IC = 8.0A, T J = 150C -- -- 100 nA VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc td(on) tr td(off) tf Eon Eoff Ets tsc td(on) tr td(off) tf Ets LE Cies Coes Cres trr Irr Qrr di(rec)M/dt Notes: Repetitive rating; V GE=20V, pulse width limited by max. junction temperature. ( See fig. 20 ) Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge Diode Peak Rate of Fall of Recovery During t b Min. -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. 17 4.3 6.4 59 38 110 80 0.28 0.15 0.43 -- 52 35 170 170 0.7 7.5 350 50 4.7 37 55 3.5 4.5 65 124 240 210 Max. Units Conditions 26 IC = 6.0A 6.8 nC VCC = 480V 11 See Fig. 8 -- TJ = 25C -- ns IC = 6.0A, V CC = 480V 210 VGE = 15V, R G = 50 120 Energy losses include "tail" and -- diode reverse recovery. -- mJ See Fig. 9, 10, 11, 18 0.90 -- s VCC = 360V, T J = 125C VGE = 15V, R G = 50, VCPK < 500V -- TJ = 150C, See Fig. 9, 10, 11, 18 -- ns IC = 6.0A, V CC = 480V -- VGE = 15V, R G = 50 -- Energy losses include "tail" and -- mJ diode reverse recovery. -- nH Measured 5mm from package -- VGE = 0V -- pF VCC = 30V See Fig. 7 -- = 1.0MHz 55 ns TJ = 25C See Fig. 90 TJ = 125C 14 I F = 8.0A 5.0 A TJ = 25C See Fig. 8.0 TJ = 125C 15 V R = 200V 138 nC TJ = 25C See Fig. 360 TJ = 125C 16 di/dt = 200A/s -- A/s TJ = 25C See Fig. -- TJ = 125C 17 Pulse width 5.0s, single shot.
VCC=80%(V CES), VGE=20V, L=10H, R G= 50, ( See fig. 19 ) Pulse width 80s; duty factor 0.1%.
C-898
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IRGBC20KD2
8
D u ty cycle : 5 0 % TJ = 12 5C T s in k = 9 0 C G a te drive a s sp ec ifie d Turn -o n losse s inclu de e ffec ts of re ve rse re co ve ry Pow er D iss ipa tion = 13 .5W
LO A D C U R RE NT (A )
6
4
6 0 % o f ra te d v o lta g e
2
0 0.1 1 10 100
f, F re quency (kH z)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I RMS of fundamental)
100
100
I C , C ollector-to-E mitte r C urren t (A )
TJ = 2 5 C
10
TJ = 1 50 C
IC , C ollector-to-E m itter Current (A )
10
TJ = 1 50 C TJ = 2 5C
1
0.1 0.1 1
V G E = 15V 2 0 s P U LS E W ID TH
10
1 5 10
V C C = 1 00 V 5 s P UL S E W ID TH
15 20
V C E , C o llector-to-Em itter V oltage (V)
V G E , G ate-to-E m itter V olta g e (V )
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
C-899
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IRGBC20KD2
10
8
V C E , C olle cto r-to -E m itter V o ltag e (V )
V G E = 1 5V
5.0
Ma xim um D C C ollector C urre nt (A )
V G E = 15 V 80 s P U L S E W ID TH
4.0
I C = 1 2A
6
3.0
4
IC = 6.0A
2.0
2
I C = 3.0 A
0 25 50 75 100 125 150
1.0 -60 -40 -2 0 0 20 40 60 80 100 120 140 160
T C , C ase Tem perature (C )
TC , C ase Tem perature (C )
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Collector-to-Emitter Voltage vs. Case Temperature
10
T herm al Response (Z thJ C )
1
D = 0.50
0 .2 0 0 .10 0.0 5
PD M
0.1
0.0 2 0 .01
t
SIN G LE P U LS E (TH ER M AL R E SP O N SE )
N o te s : 1 . D u ty fa c to r D = t 1 /t 2
1 t2
0.01 0.00001
2 . P e a k TJ = P D M x Z th J C + T C
0.0001
0.001
0.01
0.1
1
10
t 1 , R ectangular Pulse D uration (sec)
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
C-900
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IRGBC20KD2
700
600
VG E , G ate-to -E m itter V olta ge (V )
1 00
V GE = 0V, f = 1MHz C ies = C ge + C gc , C ce SHORTED C res = C gc C oes = C ce + C gc
20
V C E = 4 80 V I C = 6.0 A
16
C, C apacitance (pF)
500
Cies Coes
400
12
300
8
200
Cres
100
4
0 1 10
0 0 4 8 12 16 20
V C E , C o llector-to-Em itter V oltage (V)
Q g , Total G ate C harge (nC )
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
0.4 8 0
0.4 7 5
To ta l S w itc hing Lo ss es (m J)
T otal S w itching Losses (m J)
VC C VG E TC IC
= 48 0V = 1 5V = 25 C = 6.0A
10
R G = 50 V GE = 15 V V CC = 4 80 V
0.4 7 0
I C = 1 2A
0.4 6 5
1
I C = 6.0 A
0.4 6 0
I C = 3.0 A
0.4 5 5
0.4 5 0 20 25 30 35 40 45 50 55
0.1 -60 -40 -20 0 20 40 60 80 100 120 140 160
R G , G ate R esistance ( )
W
TC , C a s e T e m p era tu re (C )
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Case Temperature
C-901
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IRGBC20KD2
2.0 1.6
I C , C ollector-to-E mitte r C urren t (A )
T o ta l S w itc h in g L o s s e s (m J )
RG TC V CC VGE
= 50 = 1 50C = 48 0V = 1 5V
100
VG E E 2 0 V G= T J = 125 C
10
S A FE O P E RA TIN G A RE A
1.2
0.8
1
0.4
0.0 0 3 6 9 12 15
0.1 1 10 100 1000
I C , C o lle c to r-to -E m itte r C u rre n t (A )
V C E , C olle ctor-to-E m itter V oltage (V )
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
100
Fig. 12 - Turn-Off SOA
Instantaneous Forward Current - I F (A)
10
TJ = 150C TJ = 125C TJ = 25C
1
0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
Forward Voltage Drop - V FM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
C-902
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IRGBC20KD2
100 100
VR = 200V TJ = 125C TJ = 25C
80
VR = 200V TJ = 125C TJ = 25C
IF = 16A
t rr - (ns)
60
I F = 8.0A
I IRRM - (A)
I F = 16A
10
40
IF = 8.0A I F = 4.0A
I F = 4.0A
20
0 100
di f /dt - (A/s)
1000
1 100
1000
di f /dt - (A/s)
Fig. 14 - Typical Reverse Recovery vs. dif/dt
Fig. 15 - Typical Recovery Current vs. dif/dt
500
10000
VR = 200V TJ = 125C TJ = 25C
400
VR = 200V TJ = 125C TJ = 25C
300
di(rec)M/dt - (A/s)
Q RR - (nC)
I F = 16A
200
IF = 4.0A
1000
IF = 8.0A I F = 16A
I F = 8.0A
100
IF = 4.0A
0 100 100 100
di f /dt - (A/s)
1000
1000
di f /dt - (A/s)
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
C-903
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IRGBC20KD2
90% Vge Same type device as D.U.T. +Vge
Vce
80% of Vce
430F D.U.T. Ic
10% Vce Ic
90% Ic 5% Ic
td(off)
tf
Eoff =
Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode) , trr, Qrr, Irr, td(on), tr, td(off), tf
t1 t2
t1+5S Vce ic dt t1
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
GATE VOLTAGE D.U.T. 10% +Vg +Vg
trr Ic
Qrr =
trr id dt tx
tx 10% Vcc Vce Vcc 10% Ic 90% Ic DUT VOLTAGE AND CURRENT Ipk Ic
10% Irr Vcc
Vpk Irr
DIODE RECOVERY WAVEFORMS td(on) tr 5% Vce t2 Eon = Vce ie dt t1 t2 DIODE REVERSE RECOVERY ENERGY t3
t4 Erec = Vd id dt t3
t1
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining E on, td(on), tr
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining E rec, trr, Qrr, Irr
Refer to Section D for the following: Appendix D: Section D - page D-6 Fig. 18e - Macro Waveforms for Test Circuit of Fig. 18a Fig. 19 - Clamped Inductive Load Test Circuit Fig. 20 - Pulsed Collector Current Test Circuit Package Outline 1 - JEDEC Outline TO-220AB
C-904
Section D - page D-12
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